Beijing Hongkun Jiasheng Technology Co., Ltd.
Beijing Hongkun Jiasheng Technology Co., Ltd.
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Supermicro Server 3U Rackmount Microcloud Multi Node Cloud Computing
Product Description
The Supermicro MicroCloud family delivers ultra‑dense 3U rackmount servers with 5, 8, 10, or 12 independent hot‑swappable nodes — saving up to 76% rack space versus equivalent 1U servers. Each node operates independently with its own CPU, memory, storage, and networking, supporting AMD EPYC 4004/4005, Ryzen 7000/9000 (AM5), or Intel Xeon 2300 processors (up to 16 cores, 170W TDP). With front NVMe bays, PCIe 5.0 expansion, and single‑width GPU support (T4/L4/A2), the MicroCloud is purpose‑built for cloud, CDN, web hosting, virtualization, edge, and AI inference at scale.
Key Differentiators
3.3× density of 1U servers: up to 12 independent nodes in 3U
Hot‑swappable nodes — service one without downtime to others
Per node: 4 x DDR5 DIMM slots, up to 192GB at 5600 MT/s
Per node: 2 x 3.5”/2.5” hot‑swap NVMe U.2/SAS/SATA bays + 1 x M.2 PCIe 5.0 NVMe
Per node: 1 x PCIe 5.0 x8 LP slot + 1 x Micro‑LP slot; supports single‑width GPU
Per node: 2 x 2.5GbE/10GbE RJ45 + optional 25/100GbE via Micro‑LP + dedicated BMC
Centralized IPMI 2.0, Redfish, KVM‑over‑LAN, TPM 2.0
Redundant Platinum/Titanium PSUs (96% efficiency)
Specifications
| Category | Details |
|---|---|
| Form Factor | 3U rackmount, multi‑node |
| Node Configurations | 5N (GPU‑capable), 8N (standard), 10N (max CPU), 12N (legacy) |
| CPU (per node) | Single socket: AMD AM5 or Intel Xeon 2300, up to 16 cores, 170W TDP |
| Memory (per node) | 4 x DDR5 DIMM slots, up to 192GB at 5600 MT/s |
| Front Storage (per node) | 2 x 3.5”/2.5” hot‑swap NVMe U.2/SAS/SATA |
| M.2 (per node) | 1 x PCIe 5.0 x4 NVMe (2280/22110, bootable) |
| PCIe (per node) | 1 x PCIe 5.0 x8 LP + 1 x Micro‑LP; supports 1 single‑width GPU |
| Networking (per node) | 2 x 2.5GbE/10GbE RJ45 + optional Micro‑LP (25/100GbE) + dedicated BMC |
| Management | Centralized IPMI 2.0, Redfish, KVM‑over‑LAN, TPM 2.0 |
| Power Supply | 2 x redundant Platinum/Titanium (96% efficiency) |
| Dimensions (WxHxD) | 447 x 130 x 711 mm (17.6 x 5.1 x 28 in) |
| Weight (net) | ~45 kg (99 lb) |
Popular Models
AS‑3015MR‑H5TNR – 5‑node (CPU+GPU)
AS‑3015MR‑H8TNR – 8‑node (AMD EPYC/Ryzen)
AS‑3015MR‑H10TNR – 10‑node (max CPU density)
SYS‑5039MC‑H8TRF – 8‑node (Intel Xeon, DDR4)
Typical Configuration (per node)
CPU: 1 x AMD Ryzen 9 9950X (16 cores, 170W)
Memory: 128GB DDR5‑5600 (4 x 32GB)
Storage: 1 x 960GB M.2 NVMe + 2 x 3.84TB U.2 NVMe
Networking: 2 x 10GbE RJ45
Ordering Notes
Base SKU prefix: AS‑3015MR‑xxxx (AMD) / SYS‑5039MC‑xxxx (Intel)
Node suffix: H5TNR (5N), H8TNR (8N), H10TNR (10N)
Motherboard (per node): H13SRD‑F (AMD) / X11SCD‑F (Intel)